مؤتمر
Selective and Tunable Slurry for Advanced Packaging Epoxy Mold Compound
| العنوان: | Selective and Tunable Slurry for Advanced Packaging Epoxy Mold Compound |
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| المؤلفون: | Arata, Shogo, Noda, Chiaki, Ichige, Yasuhiro, Nomura, Satoyuki, Widodo, T. S., Tsunoda, N., Brun, X. F. |
| المصدر: | 2022 IEEE International Interconnect Technology Conference (IITC) Interconnect Technology Conference (IITC), 2022 IEEE International. :87-89 Jun, 2022 |
| Relation: | 2022 IEEE International Interconnect Technology Conference (IITC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781665486460 |
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| تدمد: | 23806338 |
| DOI: | 10.1109/IITC52079.2022.9881294 |