التفاصيل البيبلوغرافية
| العنوان: |
Reliability benchmark of various via prefill metals |
| المؤلفون: |
Pedreira, O. Varela, Simons, V., van der Veen, M.H, Ciofi, I., Park, S., Tokei, Zs., Croes, K., Pethe, S., Lei, W., Hwang, S., Wu, Z., Chen, F., Jansen, A., Machillot, J., Cockburn, A. |
| المصدر: |
2022 IEEE International Interconnect Technology Conference (IITC) Interconnect Technology Conference (IITC), 2022 IEEE International. :31-33 Jun, 2022 |
| Relation: |
2022 IEEE International Interconnect Technology Conference (IITC) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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