Influence of Solder on De-Embedded Capacitance

التفاصيل البيبلوغرافية
العنوان: Influence of Solder on De-Embedded Capacitance
المؤلفون: Tang, Si-Yao, Xiao, Qi-Han, Song, Tian-Hao, Wei, Xing-Chang
المصدر: 2022 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC) Electromagnetic Compatibility (APEMC), 2022 Asia-Pacific International Symposium on. :186-188 Sep, 2022
Relation: 2022 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC)
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:9781665416719
9781665416702
تدمد:26407469
DOI:10.1109/APEMC53576.2022.9888371