دورية أكاديمية
Hybrid Soldering 2.3D Assembly With High Reliability and Low Cost
| العنوان: | Hybrid Soldering 2.3D Assembly With High Reliability and Low Cost |
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| المؤلفون: | Hu, H., Huang, Y., Tsai, Y., Shih, M., Chen, K. |
| المصدر: | IEEE Journal of the Electron Devices Society IEEE J. Electron Devices Soc. Electron Devices Society, IEEE Journal of the. 10:791-796 2022 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 21686734 |
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| DOI: | 10.1109/JEDS.2022.3205951 |