مؤتمر
Process Development for Fabrication of Copper Additive-Multilayer Circuits with Component Attachment using ECA and LTS
العنوان: | Process Development for Fabrication of Copper Additive-Multilayer Circuits with Component Attachment using ECA and LTS |
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المؤلفون: | Lall, Pradeep, Narangaparambil, Jinesh, Schulze, Kyle, Hill, Curtis |
المصدر: | 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2022 21st IEEE Intersociety Conference on. :1-9 May, 2022 |
Relation: | 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 9781665485036 9781665485029 |
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تدمد: | 26942135 |
DOI: | 10.1109/iTherm54085.2022.9899536 |