مؤتمر
Correlation of Scanning Acoustic Microscopy and Transient Thermal Analysis to Identify Crack Growth in Solder Joints
| العنوان: | Correlation of Scanning Acoustic Microscopy and Transient Thermal Analysis to Identify Crack Growth in Solder Joints |
|---|---|
| المؤلفون: | Schmid, Maximilian, Hermann, Joseph, Liu, E, Elger, Gordon |
| المصدر: | 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2022 21st IEEE Intersociety Conference on. :1-6 May, 2022 |
| Relation: | 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781665485036 9781665485029 |
|---|---|
| تدمد: | 26942135 |
| DOI: | 10.1109/iTherm54085.2022.9899664 |