دورية أكاديمية
Understanding Early Failure Behavior in 3D-Interconnects: Empirical Modeling of Broadband Signal Losses in TSV-Enabled Interconnects
| العنوان: | Understanding Early Failure Behavior in 3D-Interconnects: Empirical Modeling of Broadband Signal Losses in TSV-Enabled Interconnects |
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| المؤلفون: | Coakley, K.J., Kabos, P., Moreau, s., Obeng, Y.S. |
| المصدر: | IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 69(11):6270-6276 Nov, 2022 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 00189383 15579646 |
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| DOI: | 10.1109/TED.2022.3204936 |