مؤتمر
Wire density effect on wire sweep analysis for IC packaging
| العنوان: | Wire density effect on wire sweep analysis for IC packaging |
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| المؤلفون: | Chien-Chang Pei, Su, F., Sheng-Jye Hwang, Durn-Yuan Huang, Huei-Huang Lee |
| المصدر: | 2002 Proceedings. 8th International Advanced Packaging Materials Symposium (Cat. No.02TH8617) Advanced packaging materials symposium Advanced Packaging Materials, 2002. Proceedings. 2002 8th International Symposium on. :160-165 2002 |
| Relation: | 2002 8th International Advanced Packaging Materials Symposium |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780374347 9780780374348 |
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| DOI: | 10.1109/ISAPM.2002.990380 |