التفاصيل البيبلوغرافية
| العنوان: |
From System to Package to Interconnect: An Artificial Intelligence Powered 3D X-ray Imaging Solution for Semiconductor Package Structural Analysis and Correlative Microscopic Failure Analysis |
| المؤلفون: |
Gu, Allen, Terada, Masako, Stegmann, Heiko, Rodgers, Thomas, Fu, Chao, Yang, Yanjing |
| المصدر: |
2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2022 IEEE International Symposium on the. :1-5 Jul, 2022 |
| Relation: |
2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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