مؤتمر
Flip Chip Typical Failure Case Analysis Research
| العنوان: | Flip Chip Typical Failure Case Analysis Research |
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| المؤلفون: | Han, Jun, He, ZhiDan |
| المصدر: | 2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2022 IEEE International Symposium on the. :1-6 Jul, 2022 |
| Relation: | 2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781665498159 |
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| تدمد: | 19461550 |
| DOI: | 10.1109/IPFA55383.2022.9915785 |