التفاصيل البيبلوغرافية
| العنوان: |
Ceramic Pin Grid Array with Built-in Interconnects to Locate TSV Integrated Ion Trap for Wire Bonding-free Assembly |
| المؤلفون: |
Zhao, Peng, Li, Hong Yu, Lim, Yu Dian, Hu, Liang Xing, Seit, Wen Wei, Guidoni, Luca, Tan, Chuan Seng |
| المصدر: |
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) Electronics System-Integration Technology Conference (ESTC), 2022 IEEE 9th. :1-5 Sep, 2022 |
| Relation: |
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
