مؤتمر
Ceramic Pin Grid Array with Built-in Interconnects to Locate TSV Integrated Ion Trap for Wire Bonding-free Assembly
العنوان: | Ceramic Pin Grid Array with Built-in Interconnects to Locate TSV Integrated Ion Trap for Wire Bonding-free Assembly |
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المؤلفون: | Zhao, Peng, Li, Hong Yu, Lim, Yu Dian, Hu, Liang Xing, Seit, Wen Wei, Guidoni, Luca, Tan, Chuan Seng |
المصدر: | 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) Electronics System-Integration Technology Conference (ESTC), 2022 IEEE 9th. :1-5 Sep, 2022 |
Relation: | 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) |
قاعدة البيانات: | IEEE Xplore Digital Library |
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