التفاصيل البيبلوغرافية
| العنوان: |
A novel hermetic encapsulation approach for the protection of electronics in harsh environments |
| المؤلفون: |
Spanier, Malte, Pawlikowski, Jakub, Ziesche, Steffen, Kappert, Holger, Ostmann, Andreas, Jagle, Martin, Schneider-Ramelow, Martin |
| المصدر: |
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) Electronics System-Integration Technology Conference (ESTC), 2022 IEEE 9th. :145-149 Sep, 2022 |
| Relation: |
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
