التفاصيل البيبلوغرافية
| العنوان: |
Cross-layer FeFET Reliability Modeling for Robust Hyperdimensional Computing |
| المؤلفون: |
Kumar, Shubham, Chatterjee, Swetaki, Thomann, Simon, Genssler, Paul R., Chauhan, Yogesh Singh, Amrouch, Hussam |
| المصدر: |
2022 IFIP/IEEE 30th International Conference on Very Large Scale Integration (VLSI-SoC) Very Large Scale Integration (VLSI-SoC), 2022 IFIP/IEEE 30th International Conference on. :1-6 Oct, 2022 |
| Relation: |
2022 IFIP/IEEE 30th International Conference on Very Large Scale Integration (VLSI-SoC) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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