التفاصيل البيبلوغرافية
العنوان: |
Cross-layer FeFET Reliability Modeling for Robust Hyperdimensional Computing |
المؤلفون: |
Kumar, Shubham, Chatterjee, Swetaki, Thomann, Simon, Genssler, Paul R., Chauhan, Yogesh Singh, Amrouch, Hussam |
المصدر: |
2022 IFIP/IEEE 30th International Conference on Very Large Scale Integration (VLSI-SoC) Very Large Scale Integration (VLSI-SoC), 2022 IFIP/IEEE 30th International Conference on. :1-6 Oct, 2022 |
Relation: |
2022 IFIP/IEEE 30th International Conference on Very Large Scale Integration (VLSI-SoC) |
قاعدة البيانات: |
IEEE Xplore Digital Library |