دورية أكاديمية
Board-Level Drop Impact Reliability Analysis of Dual-Side Molding System-in- Package (SiP) Modules
| العنوان: | Board-Level Drop Impact Reliability Analysis of Dual-Side Molding System-in- Package (SiP) Modules |
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| المؤلفون: | Shih, M., Wu, N., Lai, W., Chen, T., Kao, C., Hung, C.P. |
| المصدر: | IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 70(1):215-221 Jan, 2023 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 00189383 15579646 |
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| DOI: | 10.1109/TED.2022.3223632 |