مؤتمر
Pseudo-breakdown events induced by biased-thermal-stressing of intra-level Cu interconnects-reliability and performance impact
| العنوان: | Pseudo-breakdown events induced by biased-thermal-stressing of intra-level Cu interconnects-reliability and performance impact |
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| المؤلفون: | Song, W.S., Kim, T.J., Lee, D.H., Kim, T.K., Lee, C.S., Kim, J.W., Kim, S.Y., Jeong, D.K., Park, K.C., Wee, Y.J., Suh, B.S., Choi, S.M., Kang, H.-K., Suh, K.P., Kim, S.U. |
| المصدر: | 2002 IEEE International Reliability Physics Symposium. Proceedings. 40th Annual (Cat. No.02CH37320) Reliability physics symposium Reliability Physics Symposium Proceedings, 2002. 40th Annual. :305-311 2002 |
| Relation: | 2002 IEEE International Reliability Physics Symposium Proceedings. 40th Annual |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780373529 9780780373525 |
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| DOI: | 10.1109/RELPHY.2002.996653 |