Pre-fabricated High-density TSV Interposer for Programmable IC Applications

التفاصيل البيبلوغرافية
العنوان:	Pre-fabricated High-density TSV Interposer for Programmable IC Applications
المؤلفون:	Ouyang, T. Y., Hung, Y. T., Lee, O. H., Li, S. Y., Chiu, W. L., Hung, T. Y., Wu, S. H., Chang, H. H.
المصدر:	2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2022 17th International. :1-4 Oct, 2022
Relation:	2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
قاعدة البيانات:	IEEE Xplore Digital Library