التفاصيل البيبلوغرافية
العنوان: |
Pre-fabricated High-density TSV Interposer for Programmable IC Applications |
المؤلفون: |
Ouyang, T. Y., Hung, Y. T., Lee, O. H., Li, S. Y., Chiu, W. L., Hung, T. Y., Wu, S. H., Chang, H. H. |
المصدر: |
2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2022 17th International. :1-4 Oct, 2022 |
Relation: |
2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) |
قاعدة البيانات: |
IEEE Xplore Digital Library |