التفاصيل البيبلوغرافية
| العنوان: |
Low peel strength investigation in direct gold System in Package module |
| المؤلفون: |
Lo, Tsung Nan, Liu, Wei, Macatangay, Aldy, Molla, Jaynal, Hiew, Pey Fang |
| المصدر: |
2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT) Electronics Manufacturing Technology Conference (IEMT), 2022 IEEE 39th International. :1-4 Oct, 2022 |
| Relation: |
2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
