مؤتمر
Mining EDS-EBSD Data to Study Microstructure of Solder Bump with Completely Unknown Intermetallics
| العنوان: | Mining EDS-EBSD Data to Study Microstructure of Solder Bump with Completely Unknown Intermetallics |
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| المؤلفون: | Wu, Jiang, Choo, Eugene |
| المصدر: | 2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT) Electronics Manufacturing Technology Conference (IEMT), 2022 IEEE 39th International. :1-4 Oct, 2022 |
| Relation: | 2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9781665471701 |
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| DOI: | 10.1109/IEMT55343.2022.9969507 |