دورية أكاديمية
Holistic multi-scale model of contact stiffness considering subsurface deformation
| العنوان: | Holistic multi-scale model of contact stiffness considering subsurface deformation |
|---|---|
| المؤلفون: | Kono, Daisuke, (2), Jorobata, Yuki, Isobe, Hiromi |
| المصدر: | In CIRP Annals - Manufacturing Technology 2021 70(1):447-450 |
| قاعدة البيانات: | ScienceDirect |
Full Text Finder | تدمد: | 00078506 |
|---|---|
| DOI: | 10.1016/j.cirp.2021.04.030 |