دورية أكاديمية
Holistic multi-scale model of contact stiffness considering subsurface deformation
العنوان: | Holistic multi-scale model of contact stiffness considering subsurface deformation |
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المؤلفون: | Kono, Daisuke, (2), Jorobata, Yuki, Isobe, Hiromi |
المصدر: | In CIRP Annals - Manufacturing Technology 2021 70(1):447-450 |
قاعدة البيانات: | ScienceDirect |
تدمد: | 00078506 |
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DOI: | 10.1016/j.cirp.2021.04.030 |