دورية أكاديمية
Three dimensional modelling of grain boundary interaction and evolution during directional solidification of multi-crystalline silicon
| العنوان: | Three dimensional modelling of grain boundary interaction and evolution during directional solidification of multi-crystalline silicon |
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| المؤلفون: | Jain, T., Lin, H.K., Lan, C.W. |
| المصدر: | In Journal of Crystal Growth 1 March 2018 485:8-18 |
| قاعدة البيانات: | ScienceDirect |
Full Text Finder | تدمد: | 00220248 |
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| DOI: | 10.1016/j.jcrysgro.2017.12.044 |