دورية أكاديمية
The impact of copper contamination on the quality of the second wire bonding process using X-ray photoelectron spectroscopy method
| العنوان: | The impact of copper contamination on the quality of the second wire bonding process using X-ray photoelectron spectroscopy method |
|---|---|
| المؤلفون: | Lin, T.Y., Leong, W.S., Chua, K.H., Oh, R., Miao, Y., Pan, J.S., Chai, J.W. |
| المصدر: | In Microelectronics Reliability 2002 42(3):375-380 |
| قاعدة البيانات: | ScienceDirect |
Full Text Finder | تدمد: | 00262714 |
|---|---|
| DOI: | 10.1016/S0026-2714(02)00003-3 |