دورية أكاديمية
The impact of moisture in mold compound preforms on the warpage of PBGA packages
العنوان: | The impact of moisture in mold compound preforms on the warpage of PBGA packages |
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المؤلفون: | Lin, T.Y, Njoman, B, Crouthamel, D, Chua, K.H, Teo, S.Y, Ma, Y.Y |
المصدر: | In Microelectronics Reliability April 2004 44(4):603-609 |
قاعدة البيانات: | ScienceDirect |
تدمد: | 00262714 |
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DOI: | 10.1016/j.microrel.2003.08.003 |