دورية أكاديمية
The impact of moisture in mold compound preforms on the warpage of PBGA packages
| العنوان: | The impact of moisture in mold compound preforms on the warpage of PBGA packages |
|---|---|
| المؤلفون: | Lin, T.Y, Njoman, B, Crouthamel, D, Chua, K.H, Teo, S.Y, Ma, Y.Y |
| المصدر: | In Microelectronics Reliability April 2004 44(4):603-609 |
| قاعدة البيانات: | ScienceDirect |
Full Text Finder | تدمد: | 00262714 |
|---|---|
| DOI: | 10.1016/j.microrel.2003.08.003 |