دورية أكاديمية
Thermal simulation of joints with high thermal conductivities for power electronic devices
| العنوان: | Thermal simulation of joints with high thermal conductivities for power electronic devices |
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| المؤلفون: | Ishizaki, T., Yanase, M., Kuno, A., Satoh, T., Usui, M., Osawa, F., Yamada, Y. |
| المصدر: | In Microelectronics Reliability June 2015 55(7):1060-1066 |
| قاعدة البيانات: | ScienceDirect |
Full Text Finder | تدمد: | 00262714 |
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| DOI: | 10.1016/j.microrel.2015.04.005 |