دورية أكاديمية
Non-destructive imaging of defects in Ag-sinter die attach layers – A comparative study including X-ray, Scanning Acoustic Microscopy and Thermography
| العنوان: | Non-destructive imaging of defects in Ag-sinter die attach layers – A comparative study including X-ray, Scanning Acoustic Microscopy and Thermography |
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| المؤلفون: | Dreher, P., Schmidt, R., Vetter, A., Hepp, J., Karl, A., Brabec, C.J. |
| المصدر: | In Microelectronics Reliability September 2018 88-90:365-370 |
| قاعدة البيانات: | ScienceDirect |
Full Text Finder | تدمد: | 00262714 |
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| DOI: | 10.1016/j.microrel.2018.07.121 |