دورية أكاديمية
Nano-scratch evaluations of copper chemical mechanical polishing
| العنوان: | Nano-scratch evaluations of copper chemical mechanical polishing |
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| المؤلفون: | Fu, Wei-En, Chen, Chao-Chang A., Huang, Kuo-Wei, Chang, Yong-Qing, Lin, Tzeng-Yow, Chang, Chi-Sheng, Chen, Jay-San |
| المصدر: | In Thin Solid Films 1 February 2013 529:306-311 |
| قاعدة البيانات: | ScienceDirect |
Full Text Finder | تدمد: | 00406090 |
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| DOI: | 10.1016/j.tsf.2012.03.057 |