دورية أكاديمية
Effect of Cu on strain-stress relationship of W bicrystal models with grain boundary from molecular dynamics simulation
| العنوان: | Effect of Cu on strain-stress relationship of W bicrystal models with grain boundary from molecular dynamics simulation |
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| المؤلفون: | Yang, L.Y., Wu, C.Y., Peng, D.K., Shen, Y.J., Fan, J.L., Gong, H.R. |
| المصدر: | In Vacuum February 2023 208 |
| قاعدة البيانات: | ScienceDirect |
Full Text Finder | تدمد: | 0042207X |
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| DOI: | 10.1016/j.vacuum.2022.111712 |