دورية أكاديمية
Effect of Cu on strain-stress relationship of W bicrystal models with grain boundary from molecular dynamics simulation
العنوان: | Effect of Cu on strain-stress relationship of W bicrystal models with grain boundary from molecular dynamics simulation |
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المؤلفون: | Yang, L.Y., Wu, C.Y., Peng, D.K., Shen, Y.J., Fan, J.L., Gong, H.R. |
المصدر: | In Vacuum February 2023 208 |
قاعدة البيانات: | ScienceDirect |
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