دورية أكاديمية
Epoxy oxalic acid antifungal agent reinforced soy protein adhesive with long mold resistance and high bonding strength
| العنوان: | Epoxy oxalic acid antifungal agent reinforced soy protein adhesive with long mold resistance and high bonding strength |
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| المؤلفون: | Lei, Zhenghui, Qi, Jinqiu, Xie, Jiulong, Huang, Xingyan, Jiang, Yongze, Zhang, Shaobo, Jia, Shanshan, Chen, Qi, Xiao, Hui, Chen, Yuzhu |
| المصدر: | In International Journal of Adhesion and Adhesives August 2023 126 |
| قاعدة البيانات: | ScienceDirect |
Full Text Finder | تدمد: | 01437496 |
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| DOI: | 10.1016/j.ijadhadh.2023.103477 |