دورية أكاديمية
Copper post-electroplating anneal: evaluation of in-line vs. furnace anneal on layer properties
| العنوان: | Copper post-electroplating anneal: evaluation of in-line vs. furnace anneal on layer properties |
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| المؤلفون: | Haumesser, P.H ∗, Mourier, T, Maı̂trejean, S, Cordeau, M, Morel, T, Avale, X, Pollet, O, Klocke, J |
| المصدر: | In Microelectronic Engineering 2003 70(2):470-477 |
| قاعدة البيانات: | ScienceDirect |
Full Text Finder | تدمد: | 01679317 |
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| DOI: | 10.1016/S0167-9317(03)00426-X |