دورية أكاديمية
Novel dielectric capping layer approach for advanced copper interconnects using chemical grafting
العنوان: | Novel dielectric capping layer approach for advanced copper interconnects using chemical grafting |
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المؤلفون: | Bispo, I., Couturier, B., Haumesser, P.H., Mangiagalli, P., Monchoix, H., Passemard, G., Peyne, C., Roy, S., Thieriet, N., Rabinzohn, P., Bureau, C. |
المصدر: | In Microelectronic Engineering 2006 83(11):2088-2093 |
قاعدة البيانات: | ScienceDirect |
تدمد: | 01679317 |
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DOI: | 10.1016/j.mee.2006.09.033 |