دورية أكاديمية
Copper electrodeposition into macroporous silicon arrays for through silicon via applications
| العنوان: | Copper electrodeposition into macroporous silicon arrays for through silicon via applications |
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| المؤلفون: | Defforge, T., Coudron, L., Ménard, O., Grimal, V., Gautier, G., Tran-Van, F. |
| المصدر: | In Microelectronic Engineering June 2013 106:160-163 |
| قاعدة البيانات: | ScienceDirect |
Full Text Finder | تدمد: | 01679317 |
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| DOI: | 10.1016/j.mee.2013.01.014 |