دورية أكاديمية
Strain and tilt mapping in silicon around copper filled TSVs using advanced X-ray nano-diffraction
| العنوان: | Strain and tilt mapping in silicon around copper filled TSVs using advanced X-ray nano-diffraction |
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| المؤلفون: | Vianne, B., Escoubas, S., Richard, M.-I., Labat, S., Chahine, G., Schülli, T., Farcy, A., Bar, P., Fiori, V., Thomas, O. |
| المصدر: | In Microelectronic Engineering 2 April 2015 137:117-123 |
| قاعدة البيانات: | ScienceDirect |
Full Text Finder | تدمد: | 01679317 |
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| DOI: | 10.1016/j.mee.2014.12.011 |