دورية أكاديمية
De-bondable SiC[sbnd]SiC wafer bonding via an intermediate Ni nano-film
| العنوان: | De-bondable SiC[sbnd]SiC wafer bonding via an intermediate Ni nano-film |
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| المؤلفون: | Mu, Fengwen, Uomoto, Miyuki, Shimatsu, Takehito, Wang, Yinghui, Iguchi, Kenichi, Nakazawa, Haruo, Takahashi, Yoshikazu, Higurashi, Eiji, Suga, Tadatomo |
| المصدر: | In Applied Surface Science 28 January 2019 465:591-595 |
| قاعدة البيانات: | ScienceDirect |
Full Text Finder | تدمد: | 01694332 |
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| DOI: | 10.1016/j.apsusc.2018.09.050 |