دورية أكاديمية
Nucleation and growth of low resistivity copper thin films on polyimide substrates by low-temperature atomic layer deposition
العنوان: | Nucleation and growth of low resistivity copper thin films on polyimide substrates by low-temperature atomic layer deposition |
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المؤلفون: | Gao, Zihong, Zhang, Chengli, Gao, Junhua, Wang, Qiang, Xu, Guanglong, Cao, Hongtao, Zhang, Hongliang |
المصدر: | In Applied Surface Science 30 November 2023 638 |
قاعدة البيانات: | ScienceDirect |
تدمد: | 01694332 |
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DOI: | 10.1016/j.apsusc.2023.158072 |