دورية أكاديمية
Effects of outlet vent arrangement on air traps in stacked-chip scale package encapsulation
| العنوان: | Effects of outlet vent arrangement on air traps in stacked-chip scale package encapsulation |
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| المؤلفون: | Ramdan, D., Abdullah, M.Z., Yusop, N.M. |
| المصدر: | In International Communications in Heat and Mass Transfer March 2012 39(3):405-413 |
| قاعدة البيانات: | ScienceDirect |
Full Text Finder | تدمد: | 07351933 |
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| DOI: | 10.1016/j.icheatmasstransfer.2011.12.011 |