دورية أكاديمية
Effect of extrusion temperature on microstructural evolution and intergranule bonding of Al–7Si–0.3Mg (wt%) alloy rods produced by extrusion of granule compacts
العنوان: | Effect of extrusion temperature on microstructural evolution and intergranule bonding of Al–7Si–0.3Mg (wt%) alloy rods produced by extrusion of granule compacts |
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المؤلفون: | Liang, J.M., Guo, X.Q., Zheng, Y.F., Yao, X., Li, W., Zhang, D.L. |
المصدر: | In Journal of Materials Processing Tech. June 2016 232:78-89 |
قاعدة البيانات: | ScienceDirect |
تدمد: | 09240136 |
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DOI: | 10.1016/j.jmatprotec.2016.01.030 |