دورية أكاديمية
Low-temperature copper sinter-joining technology for power electronics packaging: A review
| العنوان: | Low-temperature copper sinter-joining technology for power electronics packaging: A review |
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| المؤلفون: | Wang, Yujian, Xu, Dou, Yan, Haidong, Li, Cai-Fu, Chen, Chuantong, Li, Wanli |
| المصدر: | In Journal of Materials Processing Tech. November 2024 332 |
| قاعدة البيانات: | ScienceDirect |
Full Text Finder | تدمد: | 09240136 |
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| DOI: | 10.1016/j.jmatprotec.2024.118526 |