دورية أكاديمية
Compressible thermal interface materials with high through-plane thermal conductivity from vertically oriented carbon fibers
| العنوان: | Compressible thermal interface materials with high through-plane thermal conductivity from vertically oriented carbon fibers |
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| المؤلفون: | Fu, Liqin, Kong, Nizao, Huang, Min, Tian, Yexin, Yan, Yuanwei, Wen, Bingjie, Ye, Chong, Huang, Dong, Han, Fei |
| المصدر: | In Journal of Alloys and Compounds 5 June 2024 987 |
| قاعدة البيانات: | ScienceDirect |
Full Text Finder | تدمد: | 09258388 |
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| DOI: | 10.1016/j.jallcom.2024.174200 |