دورية أكاديمية
Development of copper-boron nitride core-shell structured fillers and surface treatment for thermally conductive composites
| العنوان: | Development of copper-boron nitride core-shell structured fillers and surface treatment for thermally conductive composites |
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| المؤلفون: | Lee, Wondu, Park, Sang Duck, Kim, Jihoon, Park, Dabin, Whang, Dongmok, Kim, Jooheon |
| المصدر: | In Journal of Alloys and Compounds 25 October 2024 1003 |
| قاعدة البيانات: | ScienceDirect |
Full Text Finder | تدمد: | 09258388 |
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| DOI: | 10.1016/j.jallcom.2024.175691 |