دورية أكاديمية
Effects of pyrazine and its derivatives as inhibitors on copper film chemical-mechanical polishing properties for ruthenium-based copper interconnect
العنوان: | Effects of pyrazine and its derivatives as inhibitors on copper film chemical-mechanical polishing properties for ruthenium-based copper interconnect |
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المؤلفون: | Zhan, Ni, He, Chao, Niu, Xinhuan, Zhang, Nannan, Zou, Yida, Liu, Jianghao, Dong, Changxin, Li, Xinjie, Zhou, Jianwei |
المصدر: | In Colloids and Surfaces A: Physicochemical and Engineering Aspects 5 May 2024 688 |
قاعدة البيانات: | ScienceDirect |
تدمد: | 09277757 |
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DOI: | 10.1016/j.colsurfa.2024.133609 |