دورية أكاديمية
X-ray detection of ceramic packaging chip solder defects based on improved YOLOv5
| العنوان: | X-ray detection of ceramic packaging chip solder defects based on improved YOLOv5 |
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| المؤلفون: | Li, Ke, Xu, Linhai, Su, Lei, Gu, Jiefei, Ji, Yong, Wang, Gang, Ming, Xuefei |
| المصدر: | In NDT and E International April 2024 143 |
| قاعدة البيانات: | ScienceDirect |
Full Text Finder | تدمد: | 09638695 |
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| DOI: | 10.1016/j.ndteint.2024.103048 |