دورية أكاديمية
Wetting Behaviors and Interfacial Reaction between Sn-10Sb-5Cu High Temperature Lead-free Solder and Cu Substrate
| العنوان: | Wetting Behaviors and Interfacial Reaction between Sn-10Sb-5Cu High Temperature Lead-free Solder and Cu Substrate |
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| المؤلفون: | Zeng, Qiulian, Guo, Jianjun, Gu, Xiaolong, Zhao, Xinbing, Liu, Xiaogang |
| المصدر: | In Journal of Materials Science and Technology 2010 26(2):156-162 |
| قاعدة البيانات: | ScienceDirect |
Full Text Finder | تدمد: | 10050302 |
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| DOI: | 10.1016/S1005-0302(10)60026-6 |