دورية أكاديمية
Co-optimization of electrical-thermal–mechanical behaviors of an on-chip thermoelectric cooling system using response surface method
| العنوان: | Co-optimization of electrical-thermal–mechanical behaviors of an on-chip thermoelectric cooling system using response surface method |
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| المؤلفون: | Gong, Tingrui, Hou, Gu, Wu, Yongjia, Li, Lianghui, Wang, Yuexing, Shi, Maolin, Kang, Lingfeng, Zhou, Jie, Cao, Linwei, Gao, Lei, Ming, Tingzhen, Li, Juntao, Su, Wei |
| المصدر: | In Applied Thermal Engineering 1 May 2024 244 |
| قاعدة البيانات: | ScienceDirect |
Full Text Finder | تدمد: | 13594311 |
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| DOI: | 10.1016/j.applthermaleng.2024.122699 |