دورية أكاديمية
Plasma-activated GaAs/Si wafer bonding with high mechanical strength and electrical conductivity
العنوان: | Plasma-activated GaAs/Si wafer bonding with high mechanical strength and electrical conductivity |
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المؤلفون: | Zhao, Yongqiang, Liu, Wen, Bao, Yidi, Yang, Fuhua, Wang, Xiaodong |
المصدر: | In Materials Science in Semiconductor Processing 1 June 2022 143 |
قاعدة البيانات: | ScienceDirect |
تدمد: | 13698001 |
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DOI: | 10.1016/j.mssp.2022.106481 |