دورية أكاديمية
High-Speed Copper Filling within High Aspect Ratio Through Holes in Polymer Substrates
| العنوان: | High-Speed Copper Filling within High Aspect Ratio Through Holes in Polymer Substrates |
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| المؤلفون: | Zhu, Q.S., Toda, A., Zhang, Y., Itoh, T., Maeda, R. |
| المصدر: | In International Journal of Electrochemical Science August 2013 8(8):10568-10577 |
| قاعدة البيانات: | ScienceDirect |
| تدمد: | 14523981 |
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| DOI: | 10.1016/S1452-3981(23)13132-4 |