دورية أكاديمية
Residual stress distribution of silicon wafers machined by rotational grinding based on molecular dynamics
| العنوان: | Residual stress distribution of silicon wafers machined by rotational grinding based on molecular dynamics |
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| المؤلفون: | Liu, Haijun, Zhang, Qilong, Zhou, Jing, Tian, Xiaoqing, Chen, Shan, Dong, Fangfang, Han, Jiang |
| المصدر: | In Journal of Manufacturing Processes 15 June 2024 119:565-573 |
| قاعدة البيانات: | ScienceDirect |
Full Text Finder | تدمد: | 15266125 |
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| DOI: | 10.1016/j.jmapro.2024.04.007 |