دورية أكاديمية
Simulation of Temperature and Thermal Stress Filed during Reciprocating Traveling WEDM of Insulating Ceramics
| العنوان: | Simulation of Temperature and Thermal Stress Filed during Reciprocating Traveling WEDM of Insulating Ceramics |
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| المؤلفون: | Hou, P.J., Guo, Y.F., Sun, L.X., Deng, G.Q. |
| المصدر: | In Procedia CIRP 2013 6:410-415 |
| قاعدة البيانات: | ScienceDirect |
Full Text Finder | تدمد: | 22128271 |
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| DOI: | 10.1016/j.procir.2013.03.010 |