دورية أكاديمية
Molecular structure impacts of tetrazole derivatives on their diffusion and adsorption behaviors for microvia copper void-free filling
| العنوان: | Molecular structure impacts of tetrazole derivatives on their diffusion and adsorption behaviors for microvia copper void-free filling |
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| المؤلفون: | Yang, Jia-Qiang, Qiu, Jiang-Peng, Jin, Lei, Wang, Zhao-Yun, Song, Tao, Zhao, Yi, Yang, Xiao-Hui, Cheng, Jun, Yang, Fang-Zu, Zhan, Dong-Ping |
| المصدر: | In Surfaces and Interfaces January 2024 44 |
| قاعدة البيانات: | ScienceDirect |
Full Text Finder | تدمد: | 24680230 |
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| DOI: | 10.1016/j.surfin.2023.103679 |