دورية أكاديمية
High‐resolution integration of passives using micro‐contact printing (μCP)
| العنوان: | High‐resolution integration of passives using micro‐contact printing (μCP) |
|---|---|
| المؤلفون: | Lakeman, Charles D.E., Fleig, Patrick F. |
| المصدر: | Microelectronics International: An International Journal, 2003, Vol. 20, Issue 1, pp. 52-55. |
| URL الوصول: | http://www.emeraldinsight.com/doi/10.1108/13565360310455544 |
| قاعدة البيانات: | Emerald Insight |
Full Text Finder | تدمد: | 13565362 |
|---|---|
| DOI: | 10.1108/13565360310455544 |